青年中文bonding process的意思
bonding process中文翻譯：
粘結法
黏結法
相似詞語短語
bidding process───申辦過程；投標過程
moulding process───成型工藝
cooling process───[熱]冷卻過程
ongoing process───持續的過程
thinking process───思維過程
Mond process───蒙德法
ageing process───老化過程；老化法；時效處理
editing process───編輯處理流程
folding press───折疊式壓力機
雙語使用場景
The results also show that there are two bonding mechanisms in the bonding process.───同時研究還表明:在軋制復合過程中存在著兩種結合機理.
The technological requirement and bonding process for SC and SD type of cylindrical sleeves were introduced.───介紹了SC型和SD型筒形砂套技術要求及制作工藝.
Based on the elastic-plastic FE theory, the Punching Bonding process of the automobile sheets is simulated by using ANSYS analysis software in this paper.───采用有限元分析軟件ANSYS，基于彈塑性有限元理論建立有限元模型，對汽車板件沖壓連接過程進行了模擬。
This product design for IC assembly die bonding process on die bonder machine.───本產品是為IC封裝自動貼片機及其貼片工藝而設計.
Section 13 . 3 covers the thermocompression bonding process itself and also tape automated bonding.───13.3節的內容既涉及熱壓連接工藝本身,也涉及了自動連接的傳送帶技術.
The thermal bonding process minimizes media migration, providing consistent and reliable performance.───熱粘合過程中盡量減少濾芯的遷移, 提供一致的和可靠的性能.
It's a primal social bonding process," he added. "We're looking at the roots of empathy."───這是一種主要的社會關系過程“他最后補充到，”我們還在研究移情作用的本質。”
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.───結果顯示由于引線鍵合工藝、注塑工藝以及回流焊中封裝體各部分不同的熱膨脹系數引起的熱應力和塑性變形是產生引腳跟斷裂的主要因素。
Are the ambient conditions controlled for the bonding process?───周圍是情況嗎受約束的為會接程序?
英語使用場景
Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.
The technological requirement and bonding process for SC and SD type of cylindrical sleeves were introduced.
This product design for IC assembly die bonding process on die bonder machine.
Section 13 . 3 covers the thermocompression bonding process itself and also tape automated bonding.
Matthew: Brushing is a actually obviously been epical for him and it's a bonding, part of the bonding process.
The thermal bonding process minimizes media migration, providing consistent and reliable performance.
Statistical process control(SPC) technique is used to improve quality and reliability of microelectronic products, and monitor production conditions of wire bonding process.
Are the ambient conditions controlled for the bonding process?
In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength.