solder ball的意思

solder ball中文翻譯：

錫球；焊錫球；錫珠

相似詞語短語

solder irons───烙鐵；電烙鐵

solder paste───焊膏；[機]焊錫膏

solder wick───錫線

jewelers solder───珠寶商焊料

fluxed solder───焊劑；熔劑

solder mask───焊接掩模；焊接淹模；阻焊層; 焊接掩模，焊接淹模

solder gun───[電] 電焊槍

solder flux───焊劑；熱焊接溶劑

solder pot───焊錫爐

雙語使用場景

paper we report the analysis of underfill encapsulation between the solder ball, micro-chip...───文中主要探討了覆晶封裝底膠充填時，錫球、芯片及基板間的流動狀況。

For example of solder ball, flux residues, clamping marks.───如錫珠，助焊劑痕跡，夾抓紋之清理。

At the same time, experiments on PBGA solder ball laser reflow were carried out.───同時，本文還對PBGA釬料球激光重熔進行了試驗研究。

Furthermore, the effect of solder ball layout and stress relax buffer layer material on the fatigue life of solder joints is studied.───最后探測錫球配置方式和緩沖層材料性質對于錫球疲勞壽命的影響，以獲得高可靠度的封裝結構。

EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board.───EPBGA構裝體由七個部分所組成，分別為散熱板、成形樹脂、晶片、基板、熱通孔、錫球及印刷電路板。

The maximum cumulative equivalent creep strain was located in inner solder ball and at the edge of silicon chip.───最大累積等效蠕變應變位于內層焊點，且在芯片邊緣。

Melt the solder ball to remove the BGA.───使焊球熔化以取下芯片。

The solder ball printing device of the invention comprises a flux printing part for printing flux on an electrode pad of a substrate;───本發明的焊料球印刷裝置包括：在基板的電極焊盤上印刷助焊劑的助焊劑印刷部；

英語使用場景