solder bump的意思

solder bump中文翻譯：

焊料隆起焊盤；撞擊焊；焊接凸點

相似詞語短語

bump───adv.突然地，猛烈地；vt.碰，撞；顛簸；vi.碰撞，撞擊；顛簸而行；n.腫塊，隆起物；撞擊；n.(Bump)人名；(英、西)邦普

bump box───緩沖盒

solder irons───烙鐵；電烙鐵

solder paste───焊膏；[機]焊錫膏

solder wick───錫線

jewelers solder───珠寶商焊料

fluxed solder───焊劑；熔劑

cooter bump───庫特隆起

solder mask───焊接掩模；焊接淹模；阻焊層; 焊接掩模，焊接淹模

雙語使用場景

of solder bump is one of the key technologies for area array packaging (AAP).───釬料凸臺和互連焊點的重熔是面陣封裝的關鍵技術之一。

Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.───另外，由于柱狀塊不熔化，半導體線路板和組裝線路板之間的距離不因焊料而變窄。

Research status of laser reflow on solder bump forming of area array packages are introduced, and experimental analysis on laser reflow of PBGA solder ball is performed.───介紹了激光重熔在面陣列封裝釬料凸點成形中的研究進展，并且對PBGA共晶釬料球激光重熔進行了工藝研究。

During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.───在下一個回流工序，錫膏浸潤焊盤表面，形成一個固態錫膏凸起。

Process Flow of Electroplating Solder Bump───電鍍焊球凸點工藝流程

Current Research on the Reaction between Solder Bump and under Bump Metallurgy Systems in Flip Chip───倒裝芯片中凸點與凸點下金屬層反應的研究現狀

Research Status and Application of Laser Reflow on Solder Bump Forming of Area Array Packages───激光重熔在釬料凸點成形中的應用

Shear Fracture Model of Lead-free Solder Bump Formed with Induction Self Heat Reflow───感應自加熱重熔無鉛焊料凸臺的剪切失效模式

Preparation of SnPb solder bump by electroplating process───電鍍方法制備錫鉛焊料凸點

英語使用場景