ceramic substrate的意思

ceramic substrate中文翻譯：

陶瓷；陶瓷基片；[電子]陶瓷襯底

相似詞語短語

ceramic───n.陶瓷；陶瓷制品；adj.陶瓷的；陶器的；制陶藝術的

ceramic cookware───陶瓷炊具

ceramic hob───電陶爐

aluminia ceramic───鋁陶瓷

ceramic bowl───陶瓷碗

coir substrate───椰殼襯底

zirconia ceramic───氧化鋯陶瓷

sapphire substrate───[電子]藍寶石襯底

enamels ceramic───搪瓷

雙語使用場景

Cadmium contained in the cadmium oxide of a thick film ceramic substrate.───厚膜陶瓷基質的氧化鎘中所含的鎘。

Thick film conductor was prepared on ceramic substrate by laser micro-cladding.───采用激光微細熔覆直寫布線的方法在陶瓷基板上制備高密度厚膜導體。

The chip component comprises a ceramic substrate and at least one radiating element.───芯片元件包括陶瓷襯底和至少一個輻射元件。

If you have no experience with ceramic substrate, we will likely not be to work with you on this project.───如果你沒有與陶瓷基板的經驗，我們可能會無法與您攜手，在這個項目上。

Ti is an active metal and expected to react with YSZ and aid in wetting the ceramic substrate to help in the bonding.───鈦是一種活性金屬和預期作出反應的氧化鋯和援助在潤濕的陶瓷基板，以幫助在粘接。

a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole.───陶瓷基板兩面銅箔構成的線路通過燒結而成的過孔進行互聯導通。

The invention aims to truly eliminate flaws surrounding an internal conductor in a multilayer ceramic substrate with the internal conductor.───本發明的目的是，在具有內部導體的多層陶瓷襯底中確實消除內部導體周圍產生的缺陷。

Silver thick film conductor was fabricated directly on ceramic substrate by micro-atomization(Microjet) spraying deposition.───采用微細霧化噴射沉積直寫的方法在陶瓷基板上制備銀厚膜導體。

英語使用場景

The mechanism of scribing ceramic substrate by using RF CO2 laser is analyzed. The design of the scribing system is presented.

The technology of AlN ceramic substrate volume production is introduced in this paper.

Also, DSC is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate, especially for the strain concentrating area around the solder joints.

The characteristic of RF CO2 laser and its ceramic substrate scribing are presented.

The sensor chip is flip-chip packaged on a thin ceramic substrate using copper pillar bump technology.

Silver thick film conductor was fabricated directly on ceramic substrate by micro - atomization ( Microjet ) spraying deposition.

A novel technique of laser micro-cladding is used to flexibly and directly fabricate thick-film resistors on ceramic substrate.

The chip component comprises a ceramic substrate and at least one radiating element.