青年中文青年中文

chip bonding的意思

chip bonding中文翻譯:

片接合

相似詞語短語

bonding───v.黏合;建立關系;把(貨物)存入關棧中(bond的現在分詞);n.人與人之間的關系;鍵合;粘合

ionic bonding───離子鍵;離子鍵結;離子結合

metallic bonding───金屬鍵;金屬結合劑;[物]金屬鍵合

crisper chip───脆片

covalent bonding───共價鍵合;共價鍵;共價鍵結;共價結合

baby bonding───小面額債券(票面百元以下)

bonding time───粘結時間

bonding process───粘結法;黏結法

atomic bonding───[化學]原子鍵

雙語使用場景

embedded active chip also can be realized by backside thinning and flip chip bonding.───通過對芯片進行背面減薄和倒裝連接,可以實現有源芯片的埋嵌。

dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.───研究了熱超聲倒裝鍵合設備的核心執行機構——換能系統的動力學特性。

company also undertake external chip bonding, SMT, plug-in, assembly and other services.───公司還對外承接芯片邦定、貼片、插件、組裝等業務。

The company also undertake external chip bonding, SMT, plug-in, assembly and other services.───同時公司還對外承接芯片邦定、貼片、插件、組裝等業務。

Finally, the application prospects of microwave flip-chip bonding technology is suggested and discussed.───隨著應用頻率的提高,微波芯片與基板間的互連更多地采用了倒裝焊。

High viscosity, thixotropic paste for wire tacking, chip bonding and coil terminating.───高粘性,觸變膏體,用于導線定位、片結合、線圈終端。

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.───研究了熱超聲倒裝鍵合設備的核心執行機構——換能系統的動力學特性。

flip chip bonding technology used in modern micro - photoelectron package───現代微光電子封裝中的倒裝焊技術

Research on Flip-chip Bonding Techniques for Hybrid Focal Plane Array Applications───混成式焦平面陣列芯片倒裝互連技術研究

英語使用場景

With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.

This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding .

The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.

In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.