chip scale的意思

chip scale中文翻譯：

切屑秤

相似詞語短語

scale───n.規模；比例；鱗；刻度；數值范圍；n.（Scale）（意）斯卡萊（人名）；vi.衡量；攀登；剝落；生水垢；改變大小；vt.測量；攀登；刮鱗；依比例決定

crisper chip───脆片

chip shot───打高球；近穴擊球；削球；n.[體]近穴擊球

potato chip───n.炸土豆片

chip dale───奇普戴爾

chip ingram───芯片ingram

chip gaines───奇普·蓋恩斯

said chip───奇普說

computer chip───電腦芯片

雙語使用場景

The device's WLCSP (Wafer Level Chip Scale Package) is ultra compact, simplifying board design.───該器件的WLCSP(晶圓級芯片尺寸封裝)是超小型，簡化電路板設計。

continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.───芯片規模不斷增加、設計門數不斷增長，驗證已成為芯片開發的主要瓶頸。

I'd bet it is reaping royalties from iPhone sales too — and will until its key chip scale packaging patent expires in 2010.───我打賭它也從iPhone的銷售中獲得了版稅—并且會一直這樣，直到它的關鍵芯片級封裝專利在2010年期滿。

With the continuing increase in chip scale and design gates, verification has become the main bottleneck in chip development.───芯片規模不斷增加、設計門數不斷增長，驗證已成為芯片開發的主要瓶頸。

The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).───該器件提供兩種封裝：32引腳架構芯片級封裝（LFCSP）和25引腳晶圓級芯片規模封裝（WLCSP）。

Special chip scale characteristic: -intensive reader mode 2 g standards for another new feature is the dense reader mode.───特別的芯片級特性：密集閱讀器模式第二代標準的另一項新特性就是密集閱讀器模式。

Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package───芯片疊層球柵陣列尺寸封裝的焊球疲勞壽命預測

Performance Standard for Construction of Flip Chip and Chip Scale Bumps───倒裝芯片及芯片級凸塊結構的性能標準

英語使用場景

The Chip Scale Atomic Clock (CSAC), originally developed for DARPA, is 100 times smaller than its predecessors and uses 100 times less power as well.

However, the complexity of the design verification exponential with the increase of the chip scale.

The capability for accurate placement will continue to be important as chip scale packages and flip chip technology reduce pin pitches even further in the unending race for product miniaturization.

Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.