copper plating的意思

copper plating中文翻譯：

[化工]鍍銅；電鍍銅；紅銅

相似詞語短語

copper───adj.銅制的；vt.鍍銅；n.銅；銅幣；警察；n.(Copper)人名；(英)科珀

gold plating───[化工]鍍金；鍍金，餾金

turret plating───轉臺電鍍

plating technician───電鍍技師

plating process───電鍍工藝

plating rack───[化工]電鍍支架

plating styles───電鍍風格

plating technology───電鍍工藝

plating tester───電鍍試驗機

雙語使用場景

Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.───鍍銅：打底用，增進電鍍層附著能力，及抗蝕能力。

GRG, Copper plating, Stainless steel, Marble, Weathering steel, Custom carpet, Wood floors.───銅片，電鍍不銹鋼，大理石，耐候鋼，定做地毯，實木地板。

copper plating process an electrolytic acid copper plating system?───電鍍站是否有酸解電鍍銅系統？

The influences of the intermediate and monomer brighteners commonly used in present acid copper plating on the hardness. . .───本文主要對目前國內外常見的酸性鍍銅中間體、單體光亮劑對硬度的影響進行了測試研究。

In terms of cost management solution for high and low and the all things considered, sulfate copper plating is the vast majority of units.───根據本錢矮矮及溶液處置的不難難程度歸納思考，硫酸鹽鍍銅工藝被絕不小多數單元剝奪。

A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.───研究了一種用于鋼鐵基體化學置換鍍銅的專用復合添加劑。

Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.───生產上常用的鍍銅工藝有氰化鍍銅、酸性鍍銅、焦磷酸鹽鍍銅等。

The requirement of equipments for bright acid copper plating with sulfate bath is strict due to the specialties of the process.───硫酸鹽光亮酸性鍍銅，由于工藝的某些特殊性，對電鍍設備要求很高。

英語使用場景

Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit.

Cholride ions in acid copper plating bath were determined by nephelometry with OP emulsifier as stabilizer.

Electroless copper plating on PET fabrics using hypophosphite as reducing agent was investigated.

Is the copper plating process an electrolytic acid copper plating system?

The processing technology of electroless copper plating on graphite powders by iron powder method and formaldehyde method were studied and evaluated.

Is dummy - plating performed as part of the start-up procedure before electroless copper plating product?

The effect of maleic acid, potassium ferrocyanide and thiourea on electroless copper plating was investigated.

Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.

Cathodic polarization curve and cyclic voltammetric curve of sulfate copper plating solution are determined with 1286 electrochemical interface and rotating disc electrode.