die bonder的意思
die bonder中文翻譯:
芯片焊接機;模片結合器,裸片結合器
die die die───死吧,死吧
die die───模具
bonder 480───粘合劑480
bonder cert───農民證書
bonder md───鍵合器md
bonder dr───邦德醫生
bonder boat───債券船
bonder def───粘合劑定義
bonder inc───邦德公司
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.───集成電路粘片機是將半導體晶圓上微芯片貼裝到引線基架的半導體制造后工序關鍵性生產設備。
Its accuracy will influence the accuracy of LED die bonder.───其精度直接影響到LED粘片的精度。
Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.───是用于將IC芯片粘結到引線框架的半導體器件生產專用裝備。
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.───鍵合是IC元件生產的重要封裝過程或工序,需要在芯片鍵合機上完成。
This paper introduces the original structure and principle of the bond head device for high speed die bonder designed by author.───本文介紹作者設計的高速芯片焊接機焊頭的獨特結構和工作原理,并給出了主要設計參數和計算公式。
The device can replace the manual machine, and provide an additional equipment of varies die bonder.───該裝置可取代手動裝置,為各種粘片機提供配套設備。
This product design for IC assembly die attache process on die bonder machine.───本產品為IC集成電路封裝工藝芯片全自動固晶機上而專門設計。
The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment.───SOT-23晶體管封裝自動鍵合機是高速、高精度機電一體化精密設備。
A Real Time Multiple Targets Recognition Algorithm In The Full Automatic Die Bonder───全自動共晶粘片機實時多目標識別的實現
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.
The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.
This product design for IC assembly die attache process on die bonder machine.
The device can replace the manual machine, and provide an equipment of varies die bonder.
Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
This product design for IC assembly die bonding process on die bonder machine.
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