die bonding的意思
die bonding中文翻譯:
鋼模結合;小片接合;芯片焊接;模片鍵合
bonding───v.黏合;建立關系;把(貨物)存入關棧中(bond的現在分詞);n.人與人之間的關系;鍵合;粘合
die die die───死吧,死吧
die die───模具
ionic bonding───離子鍵;離子鍵結;離子結合
metallic bonding───金屬鍵;金屬結合劑;[物]金屬鍵合
covalent bonding───共價鍵合;共價鍵;共價鍵結;共價結合
baby bonding───小面額債券(票面百元以下)
bonding time───粘結時間
bonding process───粘結法;黏結法
Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.───芯片粘接工藝引起的器件-封裝熱失配會對MEMS器件的可靠性和性能產生顯著影響。
die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.───封裝粘結工藝養護過程要求爐內溫度均勻分布,現有養護爐不能滿足這一要求。
thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.───分析了功率型LED熱阻系統的構成,對采用銀漿和環氧膠作為芯片鍵合材料的功率型LED熱阻進行了對比研究。
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.───鍵合是IC元件生產的重要封裝過程或工序,需要在芯片鍵合機上完成。
Define the standard operating procedure of epoxy die bonding, which to be followed by operators.───制定銀膠上片工程標準作業程序,以供作業人員之依循。
Eutectic Die Bonding Technology and Its Applications in MEMS Packaging───基于共晶的MEMS芯片鍵合技術及其應用
Detection Technique and Performance Analysis of Die Missing for Die Bonding───粘片機中芯片丟失的光敏檢測方法及其分析
Hybrid Approach for Improving the Reliability of Die Bonding Process───改進晶片鍵合質量可靠性的綜合分析方法
Effects of Die Bonding on MEMS Characteristics: Cell Library───芯片粘接工藝對MEMS性能影響的單元庫法模型
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