青年中文青年中文

failure mechanisms的意思

failure mechanisms中文翻譯:

破壞機理

相似詞語短語

failure───n.失敗; 失敗的事/人; 沒做到; 故障; 破產; 歉收;n.失敗;故障;失敗者;破產

defence mechanisms───防御機制(defencemechanism的名詞復數形式);n.防御機制( defence mechanism的名詞復數 )

coping mechanisms───[醫]應對機制

defense mechanisms───防衛機制;[心理]防御機理

locking mechanisms───制動機構;鎖定機構

business failure───經營失敗;[經管]企業破產;[經管]企業倒閉

failure notice───系統退信;發送失敗通知

boot failure───自舉失敗;啟動故障

mechanical failure───[機]機械故障

雙語使用場景

Rutting, or permanent deformation, is one of the main failure mechanisms for asphalt concrete pavements.───車轍,又可稱為永久變形,是瀝青路面的主要破壞形式之一。

The failure mechanisms in high temperature PTC heater are complicated.───高溫PT C加熱器的失效機制比較復雜。

Physicalmodels, thermal stress induced failure mechanisms and property studies are discussed.───探討了增強模型、熱應力損毀機理和性能測試。

This greatly reduces the system complexity, cost, size, and weight, and eliminates failure mechanisms.───這大大降低了系統復雜性,成本,大小和重量,消除故障機制。

The equipment simulates and quantifies various failure mechanisms typically responsible for connector malfunction.───該系統可以模擬和量化典型故障,而這些故障經常引起連接器失靈。

Buehler's team carried out a series of atomic-level computer simulations that investigated the molecular failure mechanisms in silk.───比勒的團隊進行了一系列原子水平的計算機模擬,以考察天然絲中分子失靈的機制。

A screening test in which devices are operated at high temperature for an extended period of time to accelerate failure mechanisms.───一種篩選測試方法,在這種測試中,器件在高溫下運行一段時間,以加速劣質器件的損壞。

Finite element method is adopted to calculate and analyze the deformation and failure mechanisms and the rock-layer reverse cause.───采用彈塑性有限元法分析該類滑坡的變形破壞力學機制和反翹成因。

The failure mechanisms and the loading capacity of stiffened composite panels with stiffener runout are studied.───研究了復合材料加筋板筋條斜削區的失效過程并預測了結構的承載能力。

英語使用場景

Abstract: The major failure mechanisms of diamond coated cutting tools are flaking and breakthrough of diamond coating.

The main failure modes, failure mechanisms and application environment of long life Oxford type Stirling cryocooler were analyzed. High temperature operating accelerated life test method was adopted.

Physicalmodels, thermal stress induced failure mechanisms and property studies are discussed.

Furthermore, we will review major failure mechanisms operative in electronics components and PCB assemblies.

With the decrease of the MOS devices size , hot carrier effect failure get more and more heavy, it become one of the main failure mechanisms.

The failure mechanisms and the loading capacity of stiffened composite panels with stiffener runout are studied.