flip bonding的意思
flip bonding中文翻譯:
翻轉鍵合
bonding───v.黏合;建立關系;把(貨物)存入關棧中(bond的現在分詞);n.人與人之間的關系;鍵合;粘合
flip───n.彈;筋斗;vt.擲;翻轉;輕擊;vi.翻轉;蹦跳;adj.無禮的;輕率的
flip over───翻頁;翻過來;突然翻轉
ionic bonding───離子鍵;離子鍵結;離子結合
metallic bonding───金屬鍵;金屬結合劑;[物]金屬鍵合
workderra flip───workderra翻轉
covalent bonding───共價鍵合;共價鍵;共價鍵結;共價結合
baby bonding───小面額債券(票面百元以下)
bonding time───粘結時間
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.───本論文研究了MCM中芯片安裝互連、芯片倒裝焊接及其關鍵支撐技術等內容。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.───將實現3d互連的方法分為引線鍵合、倒裝芯片、硅通孔、薄膜導線等,并對它們的優缺點進行了分析。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.───采用多普勒激光振動測量系統,獲得了熱超聲倒裝鍵合過程中工具末端及芯片的振動速度曲線。
This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding .