青年中文bond pad的意思
bond pad中文翻譯：
接合焊盤
pad───vt.（用軟物）填補；abbr.（PAD）外周動脈疾病（peripheralarterialdisease）；n.襯墊；便簽簿；平板電腦；（直升機）起降場地；（火箭）發射臺；（貓或狗的）爪墊；公寓；n.（Pad）（英）帕德（男子教名Patrick的昵稱）
bond───vt.使結合；以…作保；vi.結合，團結在一起；n.(Bond)人名；(英、德、西、剛(金)、瑞典)邦德；n.債券；結合；約定；粘合劑；紐帶
amide bond───酰胺結合
peptide bond───[生化]肽鍵
incontinent pad───尿失禁墊
helicopter pad───直升飛機起降場；直升機起落坪
footing pad───腳墊；鞋墊
bond arms───鍵臂
die bond───管芯焊接[連接]，小片結法；芯片焊接
To simulate the long gold wire and large bond pad, an equivalent method was presented in thermal analysis.───為了用較小的規模模擬相對較長的金線和較大的焊盤，提出了一種溫度場分析的等效方法。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).───鈍化層(18)和聚酰亞胺層(22)將最后的互連層(16)和接合焊盤(28)隔開。
The distal end of the flexible arms 28 flexibly suspend the bond pad area 26 of the head support means.───在28靈活的雙臂末端靈活暫停焊盤面積26頭的支持手段。
The patterned bond pad includes a plurality of portions electrically connected to each other, and at least one opening therein.───第一圖案化接合墊包括彼此電性連接的多個部位以及位于其內的至少一開口。
The bond pad (28) is then formed in contact with the barrier (26), and a wire bond (30) is then made to the bond pad (28).───隨后形成接合焊盤（28）以接觸阻擋（26），且隨后對接合焊盤（28）完成線接合（30）。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.