bonding technology的意思

bonding technology中文翻譯：

焊接工藝

相似詞語短語

bonding───v.黏合；建立關系；把（貨物）存入關棧中（bond的現在分詞）；n.人與人之間的關系；鍵合；粘合

ionic bonding───離子鍵；離子鍵結；離子結合

metallic bonding───金屬鍵；金屬結合劑；[物]金屬鍵合

covalent bonding───共價鍵合；共價鍵；共價鍵結；共價結合

technology───n.技術；工藝；術語

baby bonding───小面額債券（票面百元以下）

bonding time───粘結時間

bonding process───粘結法；黏結法

atomic bonding───[化學]原子鍵

雙語使用場景

applications of cryogenic adhesive bonding technology in SQUID non - magnetic Dewar and other fields are introduced.───介紹了低溫粘接技術在SQUID 無磁杜瓦及其它領域中的應用。

silicon bonding technology is generally combined with surface silicon machining and bulk silicon machining in MEMS.───硅片鍵合往往與表面硅加工和體硅加工相結合，用在MEMS的加工工藝中。

Micro adhesive bonding technology shows great potential in the assembly of micro-electro-mechanical system (MEMS) products.───微膠接技術非常適用于微機電系統產品的自動化裝配過程。

As a new technique, bonding technology has been used widely in the maintenance of chemical engineering equipment.───纖維增強塑料因其具有優異的耐腐蝕性能而被廣泛用于制作化工設備。

Hence, the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper.───本文介紹了德國TOX公司的一種全新的沖壓連接技術及其在實際生產中的應用。

A preliminary attempt at the application of MATLAB in the study of bonding technology of structural glulam made of Larch is made.───對MATLAB在落葉松結構用集成材膠合工藝技術研究中的應用進行了初步嘗試。

Finally, by combining wafer bonding technology with other processes, a micro fluidic chip for hemocytometer is prepared.───最后，將多種工藝結合，制備了血細胞計數器的微流體分析芯片。

Finally, the application prospects of microwave flip-chip bonding technology is suggested and discussed.───隨著應用頻率的提高，微波芯片與基板間的互連更多地采用了倒裝焊。

英語使用場景

In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.

The preparation of metal bump and wire substrate have been researched, as well as flip-chip bonding technology.

Flip-chip bonding technology is a potential process in the electronic packaging.

A silicon wafer bonding technology and its application to new dielectric isolation combined with conventional V-shaped grooves are described.

Then, the ultrasonic bonding technology and quality control for soldered joint are described.

Hence, the new punching bonding technology from TOX company of Germany and its practical application are presented in this paper.