binding process的意思

binding process中文翻譯：

聯編過程

相似詞語短語

binding───n.裝訂；捆綁；粘合物；v.捆綁（bind的ing形式）；n.(Binding)人名；(德)賓丁；adj.有約束力的；捆綁的

binding group───結合基團

binding tape───捆條；包裝帶

binding as───n.(Binda)人名；(匈)賓道；(法)班達；(英、西、意、瑞典)賓達

binding affinity───[醫]親合力

binding contract───有法律約束力的契約；有約束力的合同

legally binding───有法律約束力；受法律約束；[法]有法律約束力

binding buffer───結合緩沖液

binding energy───[核]結合能；[物]束縛能；鍵能

雙語使用場景

Two different strategies were developed to study the conformational variation in the binding process.───兩種不同的作用方式，我們提出采用不同的策略進行結合過程的構象研究。

The council should agree on a binding process for any country found in non-compliance.───安理會應該就對有違約行為的國家進行約束性處理達成一致。

Even details about elements and the structure of the document become hidden in the objects created by the data binding process.───即使是元素的細節和文檔結構也隱藏在了數據綁定處理創建的對象之下。

During the binding process, hand is sure not to put under or beside the punching knife and heated stick so as to avoid accidents.───裝訂過程中，手切勿放在打孔刀以及加熱棒的下方與旁邊，以免發生意外。

It specifies whether the publisher policy configuration information should be removed from the binding process.───安全模式指定是否應該從綁定過程中移除發行者策略配置信息。

in the binding process, in order to prevent the wrong or less posts quality problems, to be wrong or at least.───在膠訂過程中，為防止錯帖和少帖的質量問題，使于二次檢查錯帖和少帖。

The binding process involves using the XMLBeans API to access the data in the actual XML instance document in an object-oriented fashion.───綁定過程包括以面向對象的方式使用XMLBeansAPI來訪問實際XML實例文檔中的數據。

The binding process generates JAXB classes with additional COBOL annotations.───綁定過程會產生帶有COBOL注解的JAXB類。

The bracket has the advantage of avoiding troublesome binding process of steel wires or rubber bands, along with convenient use.───本發明具有避免了煩瑣的鋼絲或橡膠圈結扎過程的優點，使用更加方便。

英語使用場景

In the binding process, the wire in the book for general use.

Paperback books Division wire, sewing and three bookbinding binding process.

This practice was in order to save paper, no binding process.

For strong - named assemblies, the binding process continues by looking in the global assembly cache.

Often occurs during the binding process.

Binding process may be different from the wire in the process.