青年中文electroplating的意思
electroplating中文翻譯：
n.電鍍；電鍍術
electrocuting───v.使觸電受傷；使觸電致死；以電椅處死
electrolysing───v.電解，電蝕（同electrolyze）
electrolyzing───n.電解；電離；v.電解；電離（electrolyze的ing形式）
electroplate───v.電鍍；n.電鍍品；adj.有電鍍層的
electroplated───電鍍的；電鍍
electroplater───n.電鍍工，電鍍器
electroplates───v.電鍍；n.電鍍品；adj.有電鍍層的
electroless plating───化學鍍層；[化工]無電鍍；非電解鍍層
electrofishing───電氣捕魚
Adjust the electroplating position, increase mixing effect.───調整電鍍位置，增加攪拌效果。
Electroplating time mixing effect is bad.───電鍍時間攪拌效果不良。
Used in electroplating, antisepsis and analytical reagent.───用于電鍍、防腐及分析試劑。
Such a system did not exist in electroplating.───這個系統在電鍍業是前所未有的。
The composition and nature of electroplating sludge as well as the ways for their disposal and resuscitation are reviewed.───對電鍍污泥的成分和性質、處置方法及資源化利用方式進行了綜述。
Recommended substrate: Harden PC, harden PMMA, the surface of UV coating, electroplating layer, stainless steel, stone, marble, glass, etc.───適用基材：加硬PC，加硬PMMA，UV漆面，電鍍面，不銹鋼，石頭，大理石，玻璃等。
A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency.───穿過泡沫體的電解質的傾斜流動增強電解質在泡沫體內的翻轉同時增加電鍍效率。
In terms of health risk on sensitive points, this electroplating sludge could be put into the non hazardous waste landfill site.───就該電鍍污泥填埋處置對目標敏感點處產生的地下水環境健康風險而言，其可以進入一般工業固體廢物填埋場處置。
Therefore, electroplating of lead-free solder coating is one of investigation hotspots in electronic electroplating field.───因此，電沉積無鉛可焊性鍍層是電子電鍍領域的研究熱點之一。
Inside holding electroplating process is a precise technique in producing diamond reamer.
Application: Mainly used in dry cell, electroplating, dye and precision casting, curriery, etchant, feed additive etc.
Major Application: Chelating agent in non - cyanide electroplating.
At one extreme was an electroplating plant where management took the view that operators were unintelligent and unreliable.
The history of trivalent chromium electroplating was looked back.
The codeposition mechanisms of composite electroplating were introduced.
Electroplating process in holes is a new technique for precise diamond reamer manufacturing.
It was used as a cheap substitute for pewter and as a base for electroplate finishes.
Electroplating, magnesium alloy, and other anodic treatment agents.