molding compound的意思
molding compound中文翻譯:
[塑料]模塑料;模制原料
molding───n.模塑件,鑄造物;(裝飾用的)嵌線,腳線
compound───n.[化學]化合物;混合物;復合詞;有圍欄(或圍墻)的場地(內有工廠或其他建筑群);adj.復合的;混合的;v.合成;混合;惡化,加重;和解,妥協
molding choke───成型扼流圈
cavetto molding───凹圓線腳
button molding───包鈕
molding machine───塑制機器; 切模機;造型機;鑄模機
buffing compound───磨光劑;拋光劑
palatial compound───腭復合體
iron molding───金屬型;銹痕
Mainly in a professional, bilingual supplement, molding compound personnel is our professional training objectives.───以專業為主,雙語為輔,塑造復合型人才是我們專業的培養目標。
Molding method, process, and equipment of injection molding of molding compound had been discussed in this paper.───論述了模塑料注射成型的方法、工藝、設備和模具設計方面的問題。
The sheet molding compound had an appropriate low viscosity to be molded at low pressure.───片材在模腔內有較低的粘度,適宜于低壓成型。
The chopped fiber strands may then be used in a bulk molding compound and molded into a reinforced composite article.───然后將該短切纖維束用于塊狀模塑料中使用并模塑成增強復合制品。
The matrix formulation and technical properties and processing technology of the low pressure molding compound were studied in this paper.───本文探討了低壓模塑料的配方、性能及加工工藝。
Tension and fatigue tests on a widely used packaging epoxy molding compound (EMC) were performed under room and high temperatures.───對在微電子封裝中應用很廣的環氧模塑封裝材料進行了常溫和高溫下的拉伸、疲勞實驗。
EPBGA model consists of seven parts, they are heat spreader, molding compound, chip, substrate, thermal vias , solder ball and PCB board.───EPBGA構裝體由七個部分所組成,分別為散熱板、成形樹脂、晶片、基板、熱通孔、錫球及印刷電路板。
Ultramid 8267G HS BK-102 is a heat stabilized, black pigmented, 40% mineral and glass fiber reinforced PA6 injection molding compound.───102是一種熱穩定,黑色顏料,40%的礦物和玻璃纖維增強尼龍注塑成型化合物。
Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging───集成電路封裝用環氧樹脂模塑料性能影響因素研究
Bulk Molding Compound is specifically formulated for injection molding of automotive headlamp reflector applications.
Application:Melamine resin molding compound can be applied in a wide range, mainly for producing various melamine porcelain-like tableware used by hotels, schools, fast food restaurants and household.
Molding method, process, and equipment of injection molding molding compound had been discussed in this paper.
At least one molding compound is formed and the molding compound, the first patterned solder resist layer and the second patterned solder resist layer are separated.
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