underfill的意思

underfill中文翻譯：

n.未充滿；填充不足

相似詞語短語

soreness underarm───腋下酸痛

thundering waters───雷鳴般的海水

agencies under executive branch───行政分支機構

arundel house───阿倫德爾別墅酒店

thunder tickets───雷霆門票

undesirable effect───不良效果

observationally grounded───觀測接地

hounded out───追尋到

undefined notice undefined───未定義通知未定義

under separate cover───adv.在另函中

雙語使用場景

first underfill is filled between the first chip and the second chip in order to wrap the first bump.───第一底膠，填充在所述第一芯片與所述第二芯片之間，且包覆所述第一凸塊；

with no-flow underfill is analyzed and compared with the case for conventional capillary-flow underfill.───用斷裂力學方法和有限元模擬分析了填充不流動膠芯片斷裂問題。

technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.───的倒裝芯片一般采用底部填充技術以提高其封裝的可靠性。

This makes complete sense, and it is followed by a picture of a modern chip with the bumps and underfill pointed out.───這使得完整意義上說，這是其次的圖片現代芯片的顛簸和底層指出。

The results show that the residual moisture within underfill materials enhances the stress level in solder joint.───結果表明：在濕熱環境下，底充膠材料內部殘留的濕氣提高了焊點的應力水平。

Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .───從熱疲勞故障的角度論述了倒裝芯片底部填充的必要性，介紹了倒裝芯片底部填充的參數控制。

Does your SMT facility have underfill capabilities? If so, what machines do they use?───貴公司的SMT設施擁有底充膠能力嗎？如果有的話，它們采用什么機器？

The influence of underfill and its material models on the reliability of flip chip package under thermal cycling───底充膠及其材料模型對倒裝焊熱循環可靠性的影響

Thermal conductivity prediction of underfill and its affects on the flip chip temperature field───底充膠導熱系數預測及對倒裝焊溫度場的影響

英語使用場景

DU901 is a one component, epoxy encapsulant designed for use as a repairable underfill resin for CSP or BGA.

Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.

Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.

Discuss the necessary of flip chip underfill to ther mal fatigue failures. Put forward controlling parameter for flip chip underfill .

Pot life is the useful life of an underfill encapsulant after it is removed from the freezer and thawed, typically determined by the ability to dispense uniform quantities at uniform speeds.

For avoiding the disadvantage of filling the underfill and keeping good reliability, this research proposes a novel concept of no underfill with constraint layer flip chip package.

It was found that the application of underfill encapsulation can improve reliability of flip chip significantly.